Moldflow Launches C-MOLD 2000.7 Software
19 June 2000
Latest Release Offers Robust Functionality to Enhance Productivity
CHICAGO - Moldflow Corporation , the world's leader in process wide plastic solutions, announces C-MOLD 2000.7.This latest version of the software delivers Fusion and Underfill (flip-chip) capabilities for advanced C-MOLD products. In addition, C-MOLD 2000's user interface, design optimization, and polymer melt analysis have been enhanced.
C-MOLD Fusion eliminates the time consuming task of creating a midplane model in order to do analysis. C-MOLD Fusion works directly on a CAD model and allows users to simulate both the filling and packing stages of the injection molding process. The technology functions similarly to Moldflow's flagship Plastics Insight product, and has now been extended to the recently acquired C-MOLD product.
In addition, C-MOLD 2000.7 includes an underfill encapsulation module to simulate the increasingly popular thermosetting flip-chip encapsulation process. Flip-chip, a relatively new technology for microchip packaging, does not require wire or molding for the process. The chip is bonded directly on the pc-board or substrate -- creating a smaller and denser envelope that connects to the board.
"The latest version of C-MOLD 2000 represents our commitment to the community of advanced C-MOLD users. The breadth of new capabilities will help our customers save valuable time while adding quality to their products. In an age of slashing new product development cycles, C-MOLD 2000 software addresses the tough engineering tasks that have traditionally slowed time to market," says Ken Welch, Moldflow's Vice-President of marketing.
Thermoplastic injection molding, gas-assisted injection molding, injection-compression molding, and co-injection molding can be completely simulated from filling and packing to shrinkage and warpage using the C-MOLD 2000 interface. Thermoset, rubber injection molding, RIM, RTM/SRIM, as well as microchip and flip-chip encapsulation, are also supported in the C-MOLD 2000 environment.
In addition, C-MOLD 2000's web-based engineering reporting features an improved three-step Report Wizard that automatically prompts users for input required to generate a complete report within minutes. Users can easily share reports with all members of the design team.
Availability
About Moldflow Corporation
Moldflow is the world leader in plastic simulation software used by designers and manufacturers to produce optimal plastic parts. Customers such as BASF, Baxter, BMW, Compaq, Dow Chemical, DuPont, Ford, GE Plastics, Hewlett-Packard, Lego, Mazda, Monsanto, Nypro, Toshiba, Toyota, Samsung, Sun Microsystems, and many others use Moldflow technology to produce billions of injection molded parts each year. The automotive, aerospace, computer, consumer goods, and medical industries have incorporated Moldflow's easy to use, predictive applications throughout all phases of the injection molded plastic part design to manufacture processes to reduce product costs, accelerate time-to-market and optimize plastic part production.
In 1997, Moldflow introduced the world's first solids-based design verification tool for plastics, Moldflow Part Adviser(R) (MPA(R)), for plastic part designers. In 2000, Moldflow launched www.plasticszone.com, the world's first e-business website for intelligent, predictive engineering for injection molded plastics. The site provides an array of products such as iMPA, a fully functional electronic version of the award winning Moldflow Part Adviser product. Other world-class Moldflow products include Moldflow Mold Adviser(TM), Moldflow Plastics Insight(TM) (MPI(TM)), and Moldflow Plastics Xpert(TM) (MPX(TM)).
Also in 2000, Moldflow successfully completed its initial public offering and acquired C-MOLD, formerly a primary competitor. The company maintains its corporate headquarters in Lexington, MA. The company maintains research and development facilities in Australia, the United Kingdom, and United States, as well as direct sales and marketing offices throughout the USA, Europe, and Asia.
Note to editors: Moldflow, C-MOLD 2000, Moldflow Plastics Xpert, Moldflow Plastics Advisers, Moldflow Plastics Insight, MPA, MPI, MPX, iMPA, plasticszone, and plasticszone.com are trademarks or registered trademarks of Moldflow Corporation or its subsidiaries worldwide. All other trademarks are properties of their respective holders.
Pursuant to the safe harbor provisions of the United States Private Securities Litigation Act of 1995, the Company notes that any statements contained in this press release that are not based on historical facts are forward looking statements. Such forward looking statements include statements regarding Moldflow's or management's intentions, hopes, beliefs, expectations, projections or plans for the future and include statements regarding Moldflow's market leadership in process wide plastics solutions and expected benefits, including productivity and time savings, to be derived by customers using C-MOLD 2000.7. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected. These risks and uncertainties include: market acceptance of our C-MOLD 2000.7 product, our ability to appropriately utilize our research and development spending on products that are required by the market; our ability to protect our proprietary technology; as well as other risks and uncertainties detailed from time to time in reports filed by Moldflow with the Securities and Exchange Commission, including the Company's Registration Statement on Form S-1 dated March 27, 2000 and the quarterly report on Form 10-Q for the quarter ended April 1, 2000.
